Priority Date: 07.07.10 (US 20100831694)

RADIATION-HARDENED ROIC WITH TDI CAPABILITY, MULTI-LAYER SENSOR CHIP ASSEMBLY AND METHOD FOR IMAGING

  • Application ID: EP11803926
  • Status: EXAMINATION REQUESTED

Applicant

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Technology Company

Attorney

operating since 1848
Headquarter in London and 2 offices
active in Legal Services and IP Consulting

Specialization

This EP application has the IPC combination H01 (BASIC ELECTRIC ELEMENTS) and H04 (ELECTRIC COMMUNICATION TECHNIQUE). We found, that AWA, Müller Hoffmann & Partner, Boehmert & Boehmert Anwaltspartnerschaft mbB, Troesch Scheidegger Werner AG, Dr. Graf & Partner AG and 49 others are specialized in this combination either. For a similar patent, they might be a good choice.

Timeline

  • 07.07.2010 - Priority Date (US 20100831694)
  • 12.01.2012 - Publication A1 (WO2012005749)
  • 15.05.2013 - Publication A1 (EP2591499)