Priority Date: 02.07.10 (JP 20100151984)

THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF, ACTIVE ESTER RESIN, SEMICONDUCTOR SEALING MATERIAL, PREPREG, PRINTED CIRCUIT BOARD, AND BUILD-UP FILM

  • Application ID: EP11800587
  • Status: PATENT GRANTED

Applicant

Technology company logo small
Technology Company

Attorneys

operating since 1974
Headquarter in Munich
active in Legal Services and IP Consulting
operating since 1974
Headquarter in Munich
active in Legal Services and IP Consulting

Specialization

This EP application has the IPC class C08, H01, and H05. We found, that Riechelmann & Carlsohn GbR, Stolmár & Partner Patentanwälte PartG mbB, Dr. Langfinger & Partner Partnerschaft mbB, RatnerPrestia are specialized in this combination either. For a similar patent, they might be a good choice.

Timeline

  • 02.07.2010 - Priority Date (JP 20100151984)
  • 05.01.2012 - Publication A1 (WO2012002119)
  • 08.05.2013 - Publication A1 (EP2589625)
  • 26.10.2016 - Publication B1 (EP2589625)