THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF, ACTIVE ESTER RESIN, SEMICONDUCTOR SEALING MATERIAL, PREPREG, PRINTED CIRCUIT BOARD, AND BUILD-UP FILM
- Application ID: EP11800587
- Status: █ PATENT GRANTED
This EP application has the IPC class C08, H01, and H05. We found, that Riechelmann & Carlsohn GbR, Stolmár & Partner Patentanwälte PartG mbB, Dr. Langfinger & Partner Partnerschaft mbB, RatnerPrestia are specialized in this combination either. For a similar patent, they might be a good choice.