Priority Date: 12.11.10 (DE 20101043866)

ADHESIVE COMPOUND AND METHOD FOR ENCAPSULATING AN ELECTRONIC ASSEMBLY

  • Application ID: EP11779146
  • Status: The patent has been granted

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Specialization

This EP application has the IPC class C09 (DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR). Here you find a list of all patent agent firms which are specialized in this IPC class. For a similar patent, they might be a good choice.

Timeline

  • 12.11.2010 - Priority Date (DE 20101043866)
  • 18.05.2012 - Publication A1 (WO2012062586)
  • 18.09.2013 - Publication A1 (EP2638118)
  • 06.12.2017 - Publication B1 (EP2638118)