Priority Date: 12.04.10 (US 20100322980P)

APPARATUS FOR HIGH THROUGHPUT WAFER BONDING

  • Application ID: EP11769301
  • Status: EXAMINATION REQUESTED

Attorneys

Employment test 51 - 200 employees
Company dna vossius and partner
operating since 1961
Headquarter in Munich and 3 offices
active in Legal Services and IP-related Communication Service
Employment test 51 - 200 employees
Company dna prinz and partner
operating since 1928
Headquarter in Munich and 2 offices
active in Legal Services, IP Consulting, and IP Portfolio Processing

Specialization

This EP application has the IPC class H01 (BASIC ELECTRIC ELEMENTS). Here you find a list of all patent agent firms which are specialized in this IPC class. For a similar patent, they might be a good choice.

Timeline

  • 12.04.2010 - Priority Date (US 20100322980P)
  • 20.10.2011 - Publication A2 (WO2011130040)
  • 20.02.2013 - Publication A2 (EP2559059)

IPC Classification