Priority Date: 13.04.10 (JP 20100092671)

CURABLE RESIN COMPOSITION, ADHESIVE EPOXY RESIN PASTE, DIE-BONDING AGENT, NON-CONDUCTIVE PASTE, ADHESIVE EPOXY RESIN FILM, NON-CONDUCTIVE EPOXY RESIN FILM, ANISOTROPIC CONDUCTIVE PASTE, AND ANISOTROPIC CONDUCTIVE FILM

  • Application ID: EP11768893
  • Status: APPLICATION DEEMED TO BE WITHDRAWN

Attorney

Employment test 11 - 50 employees
Company dna muller hoffmann and partner
no operation time available
Headquarter in Munich and 1 office
active in Legal Services and IP Consulting

Specialization

This EP application has the IPC class C08, C09, and H01. We found, that Patentanwälte Rauschenbach, Hoffmann Eitle PartmbB, Ter Meer Steinmeister & Partner PartGmbB, Stolmár & Partner Patentanwälte PartG mbB, Boeters & Lieck and 16 others are specialized in this combination either. For a similar patent, they might be a good choice.

Timeline

  • 13.04.2010 - Priority Date (JP 20100092671)
  • 20.10.2011 - Publication A1 (WO2011129372)
  • 20.02.2013 - Publication A1 (EP2559717)