METHOD AND APPARATUS FOR DETERMINING ACCEPTANCE/REJECTION OF FINE DIAMETER WIRE BONDING
- Application ID: EP11756134
- Status: █ GRANT OF PATENT INTENDED
This EP application has the IPC class B23, G01, H01, and H05. We found, that Jakelski & Althoff Patentanwälte PartG mbB, Rüger Barthelt Abel, Stumpf Patentanwälte PartGmbB, Dr. Johannes Heidenhain GmbH, Patentanwalt Dr. Roland Gagel and 1 other are specialized in this combination either. For a similar patent, they might be a good choice.