METHOD AND APPARATUS FOR DETERMINING ACCEPTANCE/REJECTION OF FINE DIAMETER WIRE BONDING
- Application ID: EP11756134
- Status: █ GRANT OF PATENT INTENDED
This EP application has the IPC combination B23, G01, H01, and H05. We found, that advotec., Jakelski & Althoff Patentanwälte PartG mbB, Rüger Barthelt Abel, Stumpf Patentanwälte PartGmbB, Patentanwaltskanzlei Dr. Hans-Herbert Stoffregen and 2 others are specialized in this combination either. For a similar patent, they might be a good choice.