Aqueous activator solution and process for electroless copper deposition on laser-direct structured substrates

  • Application ID: EP11184516
  • Status: NO OPPOSITION FILED WITHIN TIMELIMIT

Attorney

Employment test 51 - 200 employees
Company dna michalski huttermann and partner
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Headquarter in Düsseldorf and 1 office
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Specialization

This EP application has the IPC class C23 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL) and H05 (ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR). We found, that Riechelmann & Carlsohn GbR, Koepe & Partner Patentanwälte, Cremer & Cremer, Reichert & Kollegen, Atotech Deutschland GmbH and 5 others are specialized in this combination either. For a similar patent, they might be a good choice.

Timeline

  • 17.04.2013 - Publication A1 (EP2581469)
  • 15.04.2015 - Publication B1 (EP2581469)