MULTICHIP MODULE, PRINTED WIRING BOARD UNIT, METHOD FOR MANUFACTURING MULTICHIP MODULE, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD UNIT

  • Application ID: EP10848956
  • Status: APPLICATION WITHDRAWN

Applicant

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Technology Company

Attorney

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Specialization

This EP application has the IPC class H01 (BASIC ELECTRIC ELEMENTS) and H05 (ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR). We found, that Riechelmann & Carlsohn GbR, Viering, Jentschura & Partner mbB Patent- und Rechtsanwälte, AWA, Grünecker Patent- und Rechtsanwälte PartG mbB, Novagraaf and 47 others are specialized in this combination either. For a similar patent, they might be a good choice.

Timeline

  • 06.10.2011 - Publication A1 (WO2011121779)
  • 06.02.2013 - Publication A1 (EP2555238)