METHOD FOR TESTING A PARTIALLY ASSEMBLED MULTI-DIE DEVICE, INTEGRATED CIRCUIT DIE AND MULTI-DIE DEVICE
- Application ID: EP09787305
- Status: █ No opposition filed within time limit
This EP application has the IPC class G01 (MEASURING; TESTING). NXP Semiconductors Germany GmbH is specialized in G01. NXP Semiconductors Germany GmbH, NXP B.V., NXP B.V. is specialised in G01 (MEASURING; TESTING). Here you find a list of all patent agent firms which are specialized in this IPC class. For a similar patent, they might be a good choice.
- 26.09.2008 - Priority Date (EP 20080165280)
- 01.04.2010 - Publication A1 (WO2010035238)
- 15.06.2011 - Publication A1 (EP2331979)
- 04.07.2012 - Publication B1 (EP2331979)