Priority Date: 28.09.09 (US 20090246458P)

Method and device for testing TSVs in a 3D chip stack

  • Application ID: EP09172258
  • Status: The application is deemed to be withdrawn


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This EP application has the IPC class G01 (MEASURING; TESTING). DenK iP bvba is specialized in G01. DenK iP bvba is specialised in G01 (MEASURING; TESTING). Here you find a list of all patent agent firms which are specialized in this IPC class. For a similar patent, they might be a good choice.


  • 28.09.2009 - Priority Date (US 20090246458P)
  • 30.03.2011 - Publication A1 (EP2302403)

IPC Classification