Method and device for testing TSVs in a 3D chip stack
- Application ID: EP09172258
- Status: █ The application is deemed to be withdrawn
This EP application has the IPC class G01 (MEASURING; TESTING). DenK iP bvba is specialized in G01. DenK iP bvba is specialised in G01 (MEASURING; TESTING). Here you find a list of all patent agent firms which are specialized in this IPC class. For a similar patent, they might be a good choice.