Soldering assembly and method for recognising impurities contained in a solder
- Application ID: EP09100135
- Status: █ Examination is in progress
This EP application has the IPC combination B23, G01, and G05. We found, that isarpatent Behnisch Barth Charles Hassa Peckmann & Partner mbB, Patentanwälte Kindermann GbR, Siemens AG, Renishaw plc, Airbus Operations SAS and 3 others are specialized in this combination either. For a similar patent, they might be a good choice.