Soldering assembly and method for recognising impurities contained in a solder

  • Application ID: EP09100135
  • Status: Examination is in progress


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This EP application has the IPC combination B23, G01, and G05. We found, that isarpatent Behnisch Barth Charles Hassa Peckmann & Partner mbB, Patentanwälte Kindermann GbR, Siemens AG, Renishaw plc, Airbus Operations SAS and 3 others are specialized in this combination either. For a similar patent, they might be a good choice.


  • 25.08.2010 - Publication A1 (EP2221136)