Priority Date: 14.11.07 (US 20070939804)

METHOD FOR FORMING A PHYSICAL BOND BETWEEN A COMPONENT AND A PRINTED CIRCUIT

  • Application ID: EP08770022
  • Status: No opposition filed within time limit

Applicant

Attorney

Employment test 51 - 200 employees
Company dna hoffmann eitle
operating since 1892
Headquarter in Munich and 6 offices
active in Legal Services and IP Portfolio Processing

Specialization

This EP application has the IPC combination H01 (BASIC ELECTRIC ELEMENTS) and H05 (ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR). We found, that Riechelmann & Carlsohn GbR, Viering, Jentschura & Partner mbB Patent- und Rechtsanwälte, AWA, Grünecker Patent- und Rechtsanwälte PartG mbB, advotec. and 42 others are specialized in this combination either. For a similar patent, they might be a good choice.

Timeline

  • 14.11.2007 - Priority Date (US 20070939804)
  • 22.05.2009 - Publication A1 (WO2009064518)
  • 23.06.2010 - Publication A1 (EP2198679)
  • 29.05.2013 - Publication B1 (EP2198679)

IPC Classification