Solution and method for electrochemically depositing a metal on a substrate
- Application ID: EP08075637
- Status: █ No opposition filed within time limit
This EP application has the IPC class C23 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL) and C25 (ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR). We found, that Kailuweit & Uhlemann, Hansen und Heeschen, Charrier Rapp & Liebau, Tata Steel Nederland Technology BV, Umicore AG & Co. KG and 3 others are specialized in this combination either. For a similar patent, they might be a good choice.