Priority Date: 22.09.06 (US 20060525702)

Solenoid assembly with over-molded electronics

  • Application ID: EP07018493
  • Status: The application is deemed to be withdrawn


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This EP application has the IPC class H01 (BASIC ELECTRIC ELEMENTS). Here you find a list of all patent agent firms which are specialized in this IPC class. For a similar patent, they might be a good choice.


  • 22.09.2006 - Priority Date (US 20060525702)
  • 26.03.2008 - Publication A2 (EP1903581)
  • 22.04.2009 - Publication A3 (EP1903581)

IPC Classification