Priority Date: 21.09.06 (JP 20060255410)

Epoxy resin composition for optical-semiconductor encapsulation, cured resin thereof, and optical semiconductor device obtained with the same

  • Application ID: EP07018230
  • Status: No opposition filed within time limit


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Technology Company


Employment test 201 - 500 employees
Company dna grunecker kinkeldey stockmair and schwanhausser
operating since 1924
Headquarter in Munich and 2 offices
active in Legal Services


This EP application has the IPC combination C08 (ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON) and H01 (BASIC ELECTRIC ELEMENTS). We found, that Riechelmann & Carlsohn GbR, Patentanwälte Rauschenbach, Boehmert & Boehmert Anwaltspartnerschaft mbB, Hoffmann Eitle PartmbB, Ter Meer Steinmeister & Partner PartGmbB and 29 others are specialized in this combination either. For a similar patent, they might be a good choice.


  • 21.09.2006 - Priority Date (JP 20060255410)
  • 26.03.2008 - Publication A1 (EP1903605)
  • 29.07.2009 - Publication B1 (EP1903605)

IPC Classification