Epoxy resin composition for optical-semiconductor encapsulation, cured resin thereof, and optical semiconductor device obtained with the same
- Application ID: EP07018230
- Status: █ No opposition filed within time limit
This EP application has the IPC class C08 (ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON) and H01 (BASIC ELECTRIC ELEMENTS). We found, that TransMIT GmbH, Riechelmann & Carlsohn GbR, Patentanwälte Rauschenbach, Boehmert & Boehmert Anwaltspartnerschaft mbB, Hoffmann Eitle PartmbB and 24 others are specialized in this combination either. For a similar patent, they might be a good choice.